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3BYMESA

1- EMS

Group name : 3 Bobinados y Montajes Electrónica S.A.

Headquarters location : Spain

Nr of production locations : 1

Contact

Website : www.3bymesa.com

Main contact

Caballero Lizana

José Iván

Program manager

Tel : +34918703771

@ : j_i.caballero@3bymesa.com

Location

Margarita Salas 5

-

28521

Rivas Vaciamadrid

ES - Madrid (Comunidad de Madrid)

Notification

Search for competences

https://www.3bymesa.com/sistema-de-test-automatico-flying-probe-en-3bymesa/

Media

Production

Production building surface area

3- 1,000 to 10,000

Number of electronic boards produced per day

Number of components assembled per hour

Certificates

ISO 14001, ISO 9001

ECCESS Label

Sustainability Initiatives

Energy-efficient technologies, ongoing waste reduction programs.

Expertise market

Aeronautics & Space, Automotive, Consumer electronics, Defence & Naval, Industry & Energy, IoT & Communication, Lighting, Medical & Health, Railway & Public transport

End products

Number of customers

4- 100 to 250 clients

Type of services provided

Series type

5- Between 50.000 to 500.000

Key numbers

Year of foundation

1982

Turnover

5- From €10M to €40M

Headcount

3- Between 50 to 100

Company presentation

Spanish EMS specialized in design, assembly, testing and repair of electronic equipment

Company values & mission

In 3bymesa we will adopt your project idea, helping to carry it out to the extent required, from engineering, purchasing or Manufacturing. Flexibility We try to adapt us to customer requirements according to their needs, in the shortest time as possible, anticipating problems or new issues that arise. Efectiveness Perform just the task correctly on the first try, looking for the lowest overall cost. Closeness To maintain direct and frequent contact with our customers and suppliers.

Company expertise

Single and Double refusion lines for lead-free components from 0201 to Micro-BGA, BGA and large formats. Through Hole assembly process. Wave soldering process. Final assembly process. Factory – prototyping of high complexity (BGA, Micro BGA, etc.) Advanced Soldering Processes (Lead-Free). Technology – Chip-on-Flex surface mount components on flexible substrates. X-Ray assembly control. Varnish and encapsulated.

Industrial capacities

Test capacities

Functional tests, ICT, Fliying Probe test, Boundary Scan, AOI, X-Ray

#Keywords

EMS, Spain, railway, medical, circuits, testing, SMT, SMD, trough hole, quality, ISO001, ISO14001